METHOD FOR PRODUCING A MICRO-ELECTROMECHANICAL VIBRATION SYSTEM

A method for producing a micro-electromechanical vibration system. A carrier substrate is provided. A peripheral first channel extending from a first surface of the carrier substrate at least partially through the carrier substrate, is produced. A passivation layer is applied to the first surface, a...

Full description

Saved in:
Bibliographic Details
Main Authors Schary, Timo, Brehm, Jan David, Baader, Johannes
Format Patent
LanguageEnglish
Published 23.05.2024
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A method for producing a micro-electromechanical vibration system. A carrier substrate is provided. A peripheral first channel extending from a first surface of the carrier substrate at least partially through the carrier substrate, is produced. A passivation layer is applied to the first surface, and the peripheral first channel is at least partially filled with the passivation layer. A first polysilicon layer grows on the passivation layer and/or the first surface of the carrier substrate. A transducer element of the micro-electromechanical vibration system is arranged on a second surface of the first polysilicon layer. A second channel is produced completely through the carrier substrate in the direction of the transducer element. The second channel extends as far as the passivation layer, so that the vibratable transducer plate of the micro-electromechanical vibration system is produced adjacently to the second channel using the first polysilicon layer.
Bibliography:Application Number: US202318502558