SEMICONDUCTOR CHIP, MANUFACTURING METHOD FOR SEMICONDUCTOR CHIP, AND ELECTRONIC DEVICE
The present technology relates to a semiconductor chip capable of improving image quality of a captured image, a manufacturing method for the semiconductor chip, and an electronic device.The semiconductor chip of the present technology includes: a solid-state imaging element; and a cholesteric liqui...
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Format | Patent |
Language | English |
Published |
09.05.2024
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Online Access | Get full text |
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Abstract | The present technology relates to a semiconductor chip capable of improving image quality of a captured image, a manufacturing method for the semiconductor chip, and an electronic device.The semiconductor chip of the present technology includes: a solid-state imaging element; and a cholesteric liquid crystal layer provided on a side from which light is incident with respect to the solid-state imaging element. The cholesteric liquid crystal layer is formed by cholesteric liquid crystal. The present technology can be applied to, for example, the semiconductor chip or the like included in a camera module. |
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AbstractList | The present technology relates to a semiconductor chip capable of improving image quality of a captured image, a manufacturing method for the semiconductor chip, and an electronic device.The semiconductor chip of the present technology includes: a solid-state imaging element; and a cholesteric liquid crystal layer provided on a side from which light is incident with respect to the solid-state imaging element. The cholesteric liquid crystal layer is formed by cholesteric liquid crystal. The present technology can be applied to, for example, the semiconductor chip or the like included in a camera module. |
Author | NATORI, TAICHI |
Author_xml | – fullname: NATORI, TAICHI |
BookMark | eNrjYmDJy89L5WQIC3b19XT293MJdQ7xD1Jw9vAM0FHwdfQLdXN0DgkN8vRzV_B1DfHwd1FwA0pjU-zo56Lg6uPqHBLk7-fprODiGubp7MrDwJqWmFOcyguluRmU3VxDnD10Uwvy41OLCxKTU_NSS-JDg40MjEwMTY0tzS0cDY2JUwUAmpgzZg |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
ExternalDocumentID | US2024153978A1 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US2024153978A13 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 12:52:11 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US2024153978A13 |
Notes | Application Number: US202218548684 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240509&DB=EPODOC&CC=US&NR=2024153978A1 |
ParticipantIDs | epo_espacenet_US2024153978A1 |
PublicationCentury | 2000 |
PublicationDate | 20240509 |
PublicationDateYYYYMMDD | 2024-05-09 |
PublicationDate_xml | – month: 05 year: 2024 text: 20240509 day: 09 |
PublicationDecade | 2020 |
PublicationYear | 2024 |
RelatedCompanies | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
RelatedCompanies_xml | – name: SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
Score | 3.533528 |
Snippet | The present technology relates to a semiconductor chip capable of improving image quality of a captured image, a manufacturing method for the semiconductor... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | SEMICONDUCTOR CHIP, MANUFACTURING METHOD FOR SEMICONDUCTOR CHIP, AND ELECTRONIC DEVICE |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240509&DB=EPODOC&locale=&CC=US&NR=2024153978A1 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFPVNp-J0SkDpk8Vu_Vj7MKRLUlqxH2zt2NuwWQeCdMNV_Pe9hk33IHtLcuFIDi53v-TuAvDQ69uiu5jrqkQ6hqO9qU5hW2puzhe2JfpFV15lh5HlZ8bL1Jw24GObCyPrhH7L4oioUQL1vZLn9ervEovJ2Mr1U_6OQ8tnLx0wZYOO0TyhAVTYcMCTmMVUoXSQjZVoJGmo3IiZXMRKB7UjXVfa55NhnZey2jUq3ikcJsivrM6gUZQtOKbbv9dacBRunryxudG-9TlMxrXQ4ohlNI1HhPpB8khCN8o8l6ZZHdZAQp76MSMI7ch_k92IEf7KaTqKo4ASxicB5Rdw7_GU-ioucPYrj1k23t2NfgnNclkWV0ByYeYCHahFV5sbuiUczbJNyxCmbqCXo_Xa0NnH6Xo_-QZO6q6M9nM60Kw-v4pbtMhVficF-QM2B4ZD |
link.rule.ids | 230,309,786,891,25594,76906 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFPVNp-LH1IDSJ4vb-rHuYUiXpLS6pmNrx96GzToQpBuu4r_vNWy6B9lbyIUjObjc_S53F4CHVtuRzfnM0BXSMTuNN72TObaeWrO5Y8t21lSh7FDYfmK-TKxJBT42tTCqT-i3ao6IGiVR3wt1Xy__glhM5VauntJ3nFo8e3GXaWt0jOYJDaDGel0-iFhENUq7yUgTQ0VD5UbM5CJW2muX_XlL52ncK-tSlttGxTuG_QHyy4sTqGR5DQ7p5u-1GhyE6ydvHK61b3UK41EptEiwhMbRkFA_GDyS0BWJ59I4KdMaSMhjP2IEoR35b7ErGOF9TuNhJAJKGB8HlJ_Bvcdj6uu4wemvPKbJaPs0xjlU80WeXQBJpZVKdKDmzcbMNGyJZ3Qs25SWYaKX02hdQn0Xp6vd5Ds49OOwP-0H4vUajkqSyvzr1KFafH5lN2idi_RWCfUHpi2JMA |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=SEMICONDUCTOR+CHIP%2C+MANUFACTURING+METHOD+FOR+SEMICONDUCTOR+CHIP%2C+AND+ELECTRONIC+DEVICE&rft.inventor=NATORI%2C+TAICHI&rft.date=2024-05-09&rft.externalDBID=A1&rft.externalDocID=US2024153978A1 |