SEMICONDUCTOR PACKAGE

A semiconductor package having a lower redistribution structure includes a redistribution insulation layer, a plurality of ball pads in the redistribution insulation layer apart from one another, a double via which includes a first active via and a dummy via located on at least one of the plurality...

Full description

Saved in:
Bibliographic Details
Main Authors BAEK, Joonghyun, CHUNG, Hyunsoo, IM, Eunjeong, KWAK, Dongok
Format Patent
LanguageEnglish
Published 09.05.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

Abstract A semiconductor package having a lower redistribution structure includes a redistribution insulation layer, a plurality of ball pads in the redistribution insulation layer apart from one another, a double via which includes a first active via and a dummy via located on at least one of the plurality of ball pads and apart from each other in the redistribution insulation layer, and a first active redistribution layer electrically connected to the first active via in the redistribution insulation layer, solder balls electrically connected to the plurality of ball pads under the lower redistribution structure, a first semiconductor chip on the lower redistribution structure and electrically connected to the first active via and the first active redistribution layer of the lower redistribution structure, and a molding layer molding the first semiconductor chip on the lower redistribution structure.
AbstractList A semiconductor package having a lower redistribution structure includes a redistribution insulation layer, a plurality of ball pads in the redistribution insulation layer apart from one another, a double via which includes a first active via and a dummy via located on at least one of the plurality of ball pads and apart from each other in the redistribution insulation layer, and a first active redistribution layer electrically connected to the first active via in the redistribution insulation layer, solder balls electrically connected to the plurality of ball pads under the lower redistribution structure, a first semiconductor chip on the lower redistribution structure and electrically connected to the first active via and the first active redistribution layer of the lower redistribution structure, and a molding layer molding the first semiconductor chip on the lower redistribution structure.
Author KWAK, Dongok
IM, Eunjeong
CHUNG, Hyunsoo
BAEK, Joonghyun
Author_xml – fullname: BAEK, Joonghyun
– fullname: CHUNG, Hyunsoo
– fullname: IM, Eunjeong
– fullname: KWAK, Dongok
BookMark eNrjYmDJy89L5WQQDXb19XT293MJdQ7xD1IIcHT2dnR35WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGJoamxhamZo6GxsSpAgDobSGh
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US2024153856A1
GroupedDBID EVB
ID FETCH-epo_espacenet_US2024153856A13
IEDL.DBID EVB
IngestDate Fri Aug 16 05:54:42 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US2024153856A13
Notes Application Number: US202318386003
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240509&DB=EPODOC&CC=US&NR=2024153856A1
ParticipantIDs epo_espacenet_US2024153856A1
PublicationCentury 2000
PublicationDate 20240509
PublicationDateYYYYMMDD 2024-05-09
PublicationDate_xml – month: 05
  year: 2024
  text: 20240509
  day: 09
PublicationDecade 2020
PublicationYear 2024
RelatedCompanies SAMSUNG ELECTRONICS CO., LTD
RelatedCompanies_xml – name: SAMSUNG ELECTRONICS CO., LTD
Score 3.5450928
Snippet A semiconductor package having a lower redistribution structure includes a redistribution insulation layer, a plurality of ball pads in the redistribution...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title SEMICONDUCTOR PACKAGE
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240509&DB=EPODOC&locale=&CC=US&NR=2024153856A1
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFPVN58SPKQOlb8Vh23R5KNKlrUNZW9ZW9jaaNANB5tgq_vteQqd72luSgyM5-OXuch8BeJBkwC1BK9MpB5VpW6I0uayISZ-GC5erSJutCoUnMRkX9uvMmbXgc1sLo_uE_ujmiIgogXiv9X29-n_ECnRu5eaRf-DS13OUe4HReMeonlABGsHIC9MkSJjBmFdkRjzVNAVuh_joKx0oQ1p12g_fR6ouZbWrVKJTOEyR37I-g5ZcduCYbf9e68DRpAl547BB3-YcupkSWhIHBcuTaT_12Zv_EnbhPgpzNjaR__zvOPMi292MdQFtdPTlJfTReiJuSXhVSm4LKrgruECDi1eU0wUpr6C3j9P1fvINnKipTtajPWjX6295iwq15ndaDr-lpnb5
link.rule.ids 230,309,786,891,25594,76903
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFOebzokfUwdK34rDtal9KNKlrdWtH6yt7K00aQaCzOEq_vteQ6d72lvIwZEEfrn75T4CcCfIkI24Wap6MSxVbcQLlYmSqObD48JgdaRNqwuFg5D4mfY61-ct-NjUwsg-oT-yOSIiiiPeK3lfr_4fsRyZW7m-Z-849fnkpZajNOwYzRMaQMUZW24cORFVKLWyRAlnUlaDWyc2cqU9A0mhJEtv47ouZbVtVLwj2I9R37I6hpZYdqFDN3-vdeEgaELeOGzQtz6BXlIfWhQ6GU2j2SC26cR-dntw67kp9VXUn_9tJ8-S7cWMTqGNRF-cwQC9J2IUhJWFYBo3OTM44-hwsdJk5oIU59Dfpelit_gGOn4aTPPpSzi5hMNaJBP3zD60q69vcYXGtWLX8kx-AVpAeeM
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=SEMICONDUCTOR+PACKAGE&rft.inventor=BAEK%2C+Joonghyun&rft.inventor=CHUNG%2C+Hyunsoo&rft.inventor=IM%2C+Eunjeong&rft.inventor=KWAK%2C+Dongok&rft.date=2024-05-09&rft.externalDBID=A1&rft.externalDocID=US2024153856A1