STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE
An embedded multi-die interconnect bridge (EMIB) is fabricated on a substrate using photolithographic techniques, and the EMIB is separated from the substrate and placed on the penultimate layer of an integrated-circuit package substrate, below the top solder-resist layer. A low Z-height of the EMIB...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
25.04.2024
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Online Access | Get full text |
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Abstract | An embedded multi-die interconnect bridge (EMIB) is fabricated on a substrate using photolithographic techniques, and the EMIB is separated from the substrate and placed on the penultimate layer of an integrated-circuit package substrate, below the top solder-resist layer. A low Z-height of the EMIB, allows for useful trace and via real estate below the EMIB, to be employed in the package substrate. |
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AbstractList | An embedded multi-die interconnect bridge (EMIB) is fabricated on a substrate using photolithographic techniques, and the EMIB is separated from the substrate and placed on the penultimate layer of an integrated-circuit package substrate, below the top solder-resist layer. A low Z-height of the EMIB, allows for useful trace and via real estate below the EMIB, to be employed in the package substrate. |
Author | KHOO, Poh Boon ALUR, Amruthavalli Pallavi GOH, Eng Huat SIR, Jiun Hann MALLIK, Debendra |
Author_xml | – fullname: ALUR, Amruthavalli Pallavi – fullname: KHOO, Poh Boon – fullname: MALLIK, Debendra – fullname: GOH, Eng Huat – fullname: SIR, Jiun Hann |
BookMark | eNqNi70KwjAURjPo4N87XHAO2Crqmia3NdgmIb0ZnGqROElbqO-PFXwAp8N3-M6Szbq-iwt2r8lr51CBR6WnEbJA2hpeiht6yEXmtRRfA7n14IS8igI5WQdYZajUVFahJM2VRtCG0EtrDEqCqVQFrtn82b7GuPlxxbY5krzwOPRNHIf2Ebv4bkKd7tJDsj-mp7NI9v-9PtG1Nlk |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
ExternalDocumentID | US2024136278A1 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US2024136278A13 |
IEDL.DBID | EVB |
IngestDate | Fri Sep 06 06:13:23 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US2024136278A13 |
Notes | Application Number: US202318400784 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240425&DB=EPODOC&CC=US&NR=2024136278A1 |
ParticipantIDs | epo_espacenet_US2024136278A1 |
PublicationCentury | 2000 |
PublicationDate | 20240425 |
PublicationDateYYYYMMDD | 2024-04-25 |
PublicationDate_xml | – month: 04 year: 2024 text: 20240425 day: 25 |
PublicationDecade | 2020 |
PublicationYear | 2024 |
RelatedCompanies | Intel Corporation |
RelatedCompanies_xml | – name: Intel Corporation |
Score | 3.5421746 |
Snippet | An embedded multi-die interconnect bridge (EMIB) is fabricated on a substrate using photolithographic techniques, and the EMIB is separated from the substrate... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | STRIPPED REDISTRUBUTION-LAYER FABRICATION FOR PACKAGE-TOP EMBEDDED MULTI-DIE INTERCONNECT BRIDGE |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240425&DB=EPODOC&locale=&CC=US&NR=2024136278A1 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3NT8IwFG8IGvWmqPEDTRPNbosOOsYOxGxtJyhsy9gMnpCtJTExg8iM_75vdSgnbv1Im_al773--j6K0K1hdkVmAyyxDSF1MiOmngpT6lKQ0ox3L7OZcpD1O_2EPE3MSQ19rGNhVJ7Qb5UcETgqA34vlLxe_j9iMeVbubpL36Fp8eDFPaZV6BjUE5xBjbk9HgYsoBqlvWSs-ZHqM0BYW10HsNJOeZEuM-3zF7eMS1luKhXvEO2GMF9eHKGazBton67_XmugvVFl8oZixX2rY_Q2jiPA4ZzhiLMBVBI3KV-Y9KHzyiPsOW5UxQVjwHY4dOiz88j1OAgxH7mcMRg5SobxQIdLIFbJcGng-5zG-NfH5gTdeDymfR2WOv2jzDQZb-6rfYrq-SKXZwiTbD6zso45N-YGsaSdGpZoC9EVxLZamTTOUXPbTBfbuy_RQVktjSots4nqxeeXvALdXKTXiqQ_YQSK8g |
link.rule.ids | 230,309,786,891,25594,76903 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3NT8IwFG8IGvWmqPEDtYlmt0UHG4MDMVvbCbKvjM3gCdlaEhMziMz47_tWh3Li1valTdv09fX3vorQnWZ0edYDWNLTuFD1mW6oKTeEKrhemvEeRDaTDrJ-Z5DozxNjUkMf61gYmSf0WyZHBI7KgN8LeV8v_5VYVPpWru7Td2haPDpxnyoVOgbxBGdQoXafhQENiEJIPxkrfiRpGlzWZtcCrLRjAiiUYOnFLuNSlptCxTlEuyGMlxdHqCbyBton67_XGmjPq0zeUKy4b3WM3sZxBDicURwxOoRKYielhkl1rVcWYceyoyouGAO2w6FFRtYTU-MgxMyzGaXQ00vceKjCIxDLZLgk8H1GYvzrY3OCbh0Wk4EKU53-7cw0GW-uq32K6vkiF2cI69l8ZmYdY67NNd0UvVQzeZvzLtd7ZisT2jlqbhvpYjv5Bu0PYs-dukN_dIkOSlJpYGkZTVQvPr_EFcjpIr2W2_sDBX2N3A |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=STRIPPED+REDISTRUBUTION-LAYER+FABRICATION+FOR+PACKAGE-TOP+EMBEDDED+MULTI-DIE+INTERCONNECT+BRIDGE&rft.inventor=ALUR%2C+Amruthavalli+Pallavi&rft.inventor=KHOO%2C+Poh+Boon&rft.inventor=MALLIK%2C+Debendra&rft.inventor=GOH%2C+Eng+Huat&rft.inventor=SIR%2C+Jiun+Hann&rft.date=2024-04-25&rft.externalDBID=A1&rft.externalDocID=US2024136278A1 |