ASSEMBLIES WITH EMBEDDED SEMICONDUCTOR DEVICE MODULES AND RELATED METHODS
In a general aspect, an assembly includes a panel of organic substrate core material having a cavity defined therein, a module substrate disposed in the cavity, and a semiconductor die disposed on the module substrate. The assembly also includes a layer of prepreg organic substrate material, and a m...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
18.04.2024
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Subjects | |
Online Access | Get full text |
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Abstract | In a general aspect, an assembly includes a panel of organic substrate core material having a cavity defined therein, a module substrate disposed in the cavity, and a semiconductor die disposed on the module substrate. The assembly also includes a layer of prepreg organic substrate material, and a metal layer. The module substrate and the semiconductor die are embedded in the cavity by the layer of prepreg organic substrate material and the metal layer. The metal layer is electrically coupled with at least one of the semiconductor die or the module substrate. |
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AbstractList | In a general aspect, an assembly includes a panel of organic substrate core material having a cavity defined therein, a module substrate disposed in the cavity, and a semiconductor die disposed on the module substrate. The assembly also includes a layer of prepreg organic substrate material, and a metal layer. The module substrate and the semiconductor die are embedded in the cavity by the layer of prepreg organic substrate material and the metal layer. The metal layer is electrically coupled with at least one of the semiconductor die or the module substrate. |
Author | NEUMAIER, Klaus PAUL, Roveendra TEYSSEYRE, Jerome JEON, Oseob ZSCHIESCHANG, Olaf KIM, Jihwan |
Author_xml | – fullname: KIM, Jihwan – fullname: TEYSSEYRE, Jerome – fullname: ZSCHIESCHANG, Olaf – fullname: PAUL, Roveendra – fullname: NEUMAIER, Klaus – fullname: JEON, Oseob |
BookMark | eNrjYmDJy89L5WTwdAwOdvV18vF0DVYI9wzxUAByXF1cXF0UgMKezv5-LqHOIf5BCi6uYZ7Orgq-_i6hPkCljn4uCkGuPo4hQIW-riEe_i7BPAysaYk5xam8UJqbQdnNNcTZQze1ID8-tbggMTk1L7UkPjTYyMDIxNDIwtDS3NHQmDhVAA2eL8g |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
ExternalDocumentID | US2024128197A1 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US2024128197A13 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 12:50:16 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US2024128197A13 |
Notes | Application Number: US202318487835 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240418&DB=EPODOC&CC=US&NR=2024128197A1 |
ParticipantIDs | epo_espacenet_US2024128197A1 |
PublicationCentury | 2000 |
PublicationDate | 20240418 |
PublicationDateYYYYMMDD | 2024-04-18 |
PublicationDate_xml | – month: 04 year: 2024 text: 20240418 day: 18 |
PublicationDecade | 2020 |
PublicationYear | 2024 |
RelatedCompanies | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
RelatedCompanies_xml | – name: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
Score | 3.5420117 |
Snippet | In a general aspect, an assembly includes a panel of organic substrate core material having a cavity defined therein, a module substrate disposed in the... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | ASSEMBLIES WITH EMBEDDED SEMICONDUCTOR DEVICE MODULES AND RELATED METHODS |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240418&DB=EPODOC&locale=&CC=US&NR=2024128197A1 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFPVNp-LHlICyt2Hm2ro9FFmTjE7Wdqzt3NtIv0CQbriK_76XsOme9pZLwpEc3Edyye8AHs0s62eS0nbR6SUKVJu2E8NCsiupJeWzkehyb55vubHxNjfnNfjc_oXROKE_GhwRNSpFfa-0vV79X2Jx_bZy_ZR8YNfydRjZvLU5HaN7MlCduWOLScAD1mLMjsOWP9VjOmn0MsCz0oEKpBXSvpg56l_KatepDE_hcIL8yuoMannZgGO2rb3WgCNvk_LG5kb71ucwGoSh8JwxRnDkfRS5BAnBueAkVNIMfB6zKJgSLmYjJogX8HiMUwc-J6oyBtoo4onIDXh4AQ9DETG3jWta_IlgEYe7G-heQr1clvkVEFp0MmpKo5BUGqlFFdyWzDEG7OcpLfq9a2ju43Szf_gWThSpsiedXhPq1dd3fodOuErutex-AQQBg5M |
link.rule.ids | 230,309,786,891,25594,76904 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8QNOKbosYP1CYa3ohFxoAHYqAt2XQfhG3IG-nYlpiYQWTGf99rA8oTb71e07SXXO-u1_4O4LGdJL1EUtrImt1YgWrTRmyYSLYkNaV8NmJd7s31TCsyXmftWQk-t39hNE7ojwZHRI1aoL4X-rxe_V9icf22cv0Uf2DX8mUU9nl9Ex2jeTJQnfmwL8Y-91mdsX4U1L2J5umkUWeAsdJBB4NChbQvpkP1L2W1a1RGJ3A4xvny4hRKaV6FCtvWXqvCkbtJeWNzo33rM7AHQSDcoYMeHHm3Q4sgITgXnARKmr7HIxb6E8LF1GaCuD6PHBw68DhRlTHwjCKuCC2fB-fwMBIhsxq4pvmfCOZRsLuB1gWU82WeXgKhWTOhbWlkkkpjYVIFtyVT9AF76YJmve4V1PbNdL2ffQ8VK3SduWN7bzdwrFgqk9Ls1qBcfH2nt2iQi_hOy_EXUS6Gfg |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=ASSEMBLIES+WITH+EMBEDDED+SEMICONDUCTOR+DEVICE+MODULES+AND+RELATED+METHODS&rft.inventor=KIM%2C+Jihwan&rft.inventor=TEYSSEYRE%2C+Jerome&rft.inventor=ZSCHIESCHANG%2C+Olaf&rft.inventor=PAUL%2C+Roveendra&rft.inventor=NEUMAIER%2C+Klaus&rft.inventor=JEON%2C+Oseob&rft.date=2024-04-18&rft.externalDBID=A1&rft.externalDocID=US2024128197A1 |