INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

• Main Authors: CLARKE, James S, YOO, Hui Jae, CHEBIAM, Ramanan V, INDUKURI, Tejaswi K
• Format: Patent
• Language: English
• Published: 04.04.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A dielectric layer and a method of forming thereof. An opening defined in a dielectric layer and a wire deposited within the opening, wherein the wire includes a core material surrounded by a jacket material, wherein the jacket material exhibits a first resistivity ρ1 and the core material exhibits...