3D System and Wafer Reconstitution with Mid-layer Interposer

• Main Authors: Dabral, Sanjay, Jangam, SivaChandra
• Format: Patent
• Language: English
• Published: 28.03.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A system in package structure and method of fabrication using wafer reconstitution are described. In an embodiment a 3D system includes a mid-layer interposer a first package level underneath the mid-layer interposer and a second package level over the mid-layer interposer. Second package level comp...