OPTOELECTRONIC COMPUTING PLATFORM
An integrated circuit interposer includes a semiconductor substrate layer; a first metal contact layer including a first metal contact section that includes metal contacts arranged for electrically coupling to a first semiconductor die in a controlled collapsed chip connection, and a second metal co...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English |
Published |
07.03.2024
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Subjects | |
Online Access | Get full text |
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Abstract | An integrated circuit interposer includes a semiconductor substrate layer; a first metal contact layer including a first metal contact section that includes metal contacts arranged for electrically coupling to a first semiconductor die in a controlled collapsed chip connection, and a second metal contact section that includes metal contacts arranged for electrically coupling to a second semiconductor die in a controlled collapsed chip connection. A first patterned layer includes individually photomask patterned metal path sections. A second patterned layer includes individually photomask patterned waveguide sections, including a first waveguide that crosses at least one boundary between individually photomask patterned waveguide sections. A first modulator is coupled to the first waveguide for modulating an optical wave in the first waveguide based on an electrical signal received at a first metal contact in the first metal contact section, and a second modulator is coupled to the first waveguide for modulating the optical wave based on an electrical signal received at a second metal contact in the first metal contact section or the second metal contact section |
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AbstractList | An integrated circuit interposer includes a semiconductor substrate layer; a first metal contact layer including a first metal contact section that includes metal contacts arranged for electrically coupling to a first semiconductor die in a controlled collapsed chip connection, and a second metal contact section that includes metal contacts arranged for electrically coupling to a second semiconductor die in a controlled collapsed chip connection. A first patterned layer includes individually photomask patterned metal path sections. A second patterned layer includes individually photomask patterned waveguide sections, including a first waveguide that crosses at least one boundary between individually photomask patterned waveguide sections. A first modulator is coupled to the first waveguide for modulating an optical wave in the first waveguide based on an electrical signal received at a first metal contact in the first metal contact section, and a second modulator is coupled to the first waveguide for modulating the optical wave based on an electrical signal received at a second metal contact in the first metal contact section or the second metal contact section |
Author | Meng, Huaiyu Terry, Jonathan Shen, Yichen Hendry, Gilbert Steinman, Maurice Lu, Cheng-Kuan Deng, Jingdong |
Author_xml | – fullname: Meng, Huaiyu – fullname: Shen, Yichen – fullname: Steinman, Maurice – fullname: Lu, Cheng-Kuan – fullname: Hendry, Gilbert – fullname: Deng, Jingdong – fullname: Terry, Jonathan |
BookMark | eNrjYmDJy89L5WRQ9A8I8Xf1cXUOCfL383RWcPb3DQgN8fRzVwjwcQxx8w_y5WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGJgbm5uampo6GxsSpAgCxHiVN |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences Physics |
ExternalDocumentID | US2024077755A1 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US2024077755A13 |
IEDL.DBID | EVB |
IngestDate | Fri Aug 02 08:59:44 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US2024077755A13 |
Notes | Application Number: US202318139996 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240307&DB=EPODOC&CC=US&NR=2024077755A1 |
ParticipantIDs | epo_espacenet_US2024077755A1 |
PublicationCentury | 2000 |
PublicationDate | 20240307 |
PublicationDateYYYYMMDD | 2024-03-07 |
PublicationDate_xml | – month: 03 year: 2024 text: 20240307 day: 07 |
PublicationDecade | 2020 |
PublicationYear | 2024 |
RelatedCompanies | Lightelligence, Inc |
RelatedCompanies_xml | – name: Lightelligence, Inc |
Score | 3.5328732 |
Snippet | An integrated circuit interposer includes a semiconductor substrate layer; a first metal contact layer including a first metal contact section that includes... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF |
Title | OPTOELECTRONIC COMPUTING PLATFORM |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240307&DB=EPODOC&locale=&CC=US&NR=2024077755A1 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_G_HzTqkydUlH6Vtzapt0eimxp6ybrB1srextNm4Igc9iK_77XuOme9pg7uCQHl7tL7n4BeMAYQ-tmHUPNCm6oBjN7amrqTM01xkmadk2S1S-6fmCOEuNlTuYNeN_0wgic0G8BjogWlaG9V-K8Xv1fYjmitrJ8ZG9I-njyYttR1tlxDS7XsRRnaLtR6IRUodROZkow_eVZlkXIAHOlvTqQrpH23ddh3Zey2nYq3gnsRyhvWZ1Cgy8lOKKbv9ckOPTXT94SHIgazaxE4toOyzO4C6M4dCcujadhMKYyDf0oicfBsxxNBjEmdv453HtuTEcqzrr42-QimW0vUb-AJqb_vAVyLy8wCCgKrueWkbK0j16HaQSVSbIiN_qX0N4l6Wo3-xqO66GoqrLa0Kw-v_gNutmK3Qrt_AADLnzu |
link.rule.ids | 230,309,786,891,25594,76903 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1ZT8JAEJ4QPPBNUeOBitH0rZGj24WHxsC2FbRXYGt4a7o9EhODRGr8-05XUJ54nUlmdyeZnfl2jgW4xxij005amprkmaZqQu-psd4VatoRGYnjtk6SMqPrevoo1J5nZFaB93UvjJwT-i2HI6JFJWjvhbyvF_-PWKasrVw-iDckfTza3DCVFTouh8u1qGIODSvwTZ8pjBnhVPEmvzxKKSEDxEo7FEGhBEuvw7IvZbHpVOxD2A1Q3rw4gko2r0ONrf9eq8O-u0p512FP1mgmSySu7HB5DLd-wH3LsRif-N6YNZnvBiEfe0_NwBlwBHbuCdzZFmcjFVeN_g4ZhdPNLXZPoYrwPzuDZi_NMQjI86ybUi0WcR-9jugQVCZJ8lTrn0Njm6SL7ewbqI2460TO2Hu5hIOSJSusaAOqxedXdoUutxDXUlM__2V_2A |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=OPTOELECTRONIC+COMPUTING+PLATFORM&rft.inventor=Meng%2C+Huaiyu&rft.inventor=Shen%2C+Yichen&rft.inventor=Steinman%2C+Maurice&rft.inventor=Lu%2C+Cheng-Kuan&rft.inventor=Hendry%2C+Gilbert&rft.inventor=Deng%2C+Jingdong&rft.inventor=Terry%2C+Jonathan&rft.date=2024-03-07&rft.externalDBID=A1&rft.externalDocID=US2024077755A1 |