POWER SEMICONDUCTOR MODULES AND METHOD FOR THEIR ASSEMBLING

The disclosure provides power semiconductor modules and their assembling methods. The module includes a heat-dissipation contact area, a housing and a press-on element. One of the housing and the press-on element includes a rail portion, while the other includes a rail cooperating portion. The housi...

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Bibliographic Details
Main Authors Jiang, Ke, Qian, Qiuxiao, Zhu, Chunlin
Format Patent
LanguageEnglish
Published 01.02.2024
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The disclosure provides power semiconductor modules and their assembling methods. The module includes a heat-dissipation contact area, a housing and a press-on element. One of the housing and the press-on element includes a rail portion, while the other includes a rail cooperating portion. The housing and the press-on element respectively includes a first limiting portion and a first limiting cooperating portion. The rail cooperating portion can be inserted into the rail portion and slides on the rail portion in the direction toward or away from the plane where the heat-dissipation contact area is located, so that the press-on element could move from the separation position to the mounted position connected with the housing. The rail portion can cooperate with the rail cooperating portion to prevent the press-on element from moving relative to the housing in the direction parallel to the plane where the heat-dissipation contact area is located.
Bibliography:Application Number: US202318324731