HIGH-SPEED READOUT IMAGE SENSOR

• Main Authors: Yeh, Shang-Fu, Yaung, Dun-Nian, Hsu, Tzu-Hsuan, Wang, Chen-Jong, Wang, Tzu-Jui, Chung, Chi-Hsien
• Format: Patent
• Language: English
• Published: 11.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Various embodiments of the present disclosure are directed towards an image sensor. The image sensor includes a first chip bonded to a second chip. The first chip includes a semiconductor substrate. The first chip includes a first transistor cell and a second transistor cell. The second transistor c...