POWER MODULE PACKAGING STRUCTURE

A power module is disclosed. The power module includes a first conductive plate, a first power component, and a second power component. The first conductive plate has a first side and a second side opposite to the first side; The first power component is disposed at the first side. The second power...

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Bibliographic Details
Main Authors LIU, Chih-Ming, CHANG, Hung Cheng, CHEN, Yung-Fa
Format Patent
LanguageEnglish
Published 02.11.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract A power module is disclosed. The power module includes a first conductive plate, a first power component, and a second power component. The first conductive plate has a first side and a second side opposite to the first side; The first power component is disposed at the first side. The second power component is disposed at a first location of the second side distinct from a second location of the second side. The second location is configured to transfer most heat from the first power component to the second power component if the second power component is disposed at the second location.
AbstractList A power module is disclosed. The power module includes a first conductive plate, a first power component, and a second power component. The first conductive plate has a first side and a second side opposite to the first side; The first power component is disposed at the first side. The second power component is disposed at a first location of the second side distinct from a second location of the second side. The second location is configured to transfer most heat from the first power component to the second power component if the second power component is disposed at the second location.
Author CHANG, Hung Cheng
LIU, Chih-Ming
CHEN, Yung-Fa
Author_xml – fullname: LIU, Chih-Ming
– fullname: CHANG, Hung Cheng
– fullname: CHEN, Yung-Fa
BookMark eNrjYmDJy89L5WRQCPAPdw1S8PV3CfVxVQhwdPZ2dPf0c1cIDgkKdQ4JDXLlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkbGxqZGxmYWjobGxKkCAHGzJMY
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US2023352368A1
GroupedDBID EVB
ID FETCH-epo_espacenet_US2023352368A13
IEDL.DBID EVB
IngestDate Fri Jul 19 13:03:36 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US2023352368A13
Notes Application Number: US202217731203
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231102&DB=EPODOC&CC=US&NR=2023352368A1
ParticipantIDs epo_espacenet_US2023352368A1
PublicationCentury 2000
PublicationDate 20231102
PublicationDateYYYYMMDD 2023-11-02
PublicationDate_xml – month: 11
  year: 2023
  text: 20231102
  day: 02
PublicationDecade 2020
PublicationYear 2023
RelatedCompanies Universal Scientific Industrial (Shanghai) Co., Ltd
Advanced Semiconductor Engineering, Inc
RelatedCompanies_xml – name: Advanced Semiconductor Engineering, Inc
– name: Universal Scientific Industrial (Shanghai) Co., Ltd
Score 3.4989276
Snippet A power module is disclosed. The power module includes a first conductive plate, a first power component, and a second power component. The first conductive...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title POWER MODULE PACKAGING STRUCTURE
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231102&DB=EPODOC&locale=&CC=US&NR=2023352368A1
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1JS8NAFH6UKupNq-JSJaDkFlwmnSaHIOkkaV2ykEV7KzNZQJBabMS_78uQak-9DLPArLzlm3nvDcA1z01yKwamJihiEz0nQjMqYWBS3ZlFjjxTWlX6AZ1k-tN0MO3Ax8oXRsYJ_ZHBEZGicqT3WvLrxf8lliNtK5c34h2rPh-81HLUFh2jsoICU3VGlhuFTshUxqwsUYNYtqGuQahhI1baQkV62NCD-zpq_FIW60LF24ftCPub1wfQKec92GWrv9d6sOO3T96YbalveQhKFL65seKHTvbiKpHNnu3xYzBWkjTOWGO-cARXnpuyiYZDzf5WNsuS9XmRY-gi5i9PQBFDs-ScF1TPqU4JHjfipIJTkXOzooScQn9TT2ebm89hrylKl7r7PnTrr-_yAmVrLS7llvwCPpJ5eg
link.rule.ids 230,309,783,888,25576,76876
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5KFetNq2K1akDJLfjYdNscgrSbtKnNizy0t5BNExCkFhvx7ztZUu2pl2XZgdkX8_h2Z3YB7tJMIw-8pymcIjZRM8KVQcEHWBSP2iJDnSmiKh2XWrH6Mu_NG_CxyYUR74T-iMcRUaIylPdS6OvV_yGWIWIr1_f8HZs-n8eRbsg1OkZnBQ2mbIx00_cMj8mM6XEou4Ggoa9B6GCIWGkPnex-JQ_m66jKS1ltG5XxEez7yG9ZHkMjX7ahxTZ_r7XhwKmvvLFaS9_6BCTfezMDyfGM2DYlf8hmw8nUnUhhFMSsCl84hduxGTFLwa6Sv5klcbg9LnIGTcT8-TlIvK_laZouqJpRlRLcbsRJi5TyLNUKSkgHurs4Xewm30DLihw7safu7BIOK5JIr3vqQrP8-s6v0M6W_Foszy8cGXxt
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=POWER+MODULE+PACKAGING+STRUCTURE&rft.inventor=LIU%2C+Chih-Ming&rft.inventor=CHANG%2C+Hung+Cheng&rft.inventor=CHEN%2C+Yung-Fa&rft.date=2023-11-02&rft.externalDBID=A1&rft.externalDocID=US2023352368A1