SEMICONDUCTOR DEVICE PACKAGE

• Main Authors: LIN, Cheng-Nan, LEE, Ming-Chiang, YEH, Yung-I
• Format: Patent
• Language: English
• Published: 28.09.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor device package is disclosed. The semiconductor device package includes a carrier, a first electronic component disposed on the carrier and a support component disposed on the carrier. The semiconductor device package also includes a second electronic component disposed on the first e...