THERMOPLASTIC COMPOSITIONS COMPRISING BIMODAL POLYETHYLENE AND ARTICLES MANUFACTURED THEREFROM

• Main Authors: Heitsch, Andrew T, Szul, John F, Esseghir, Mohamed, Kapur, Mridula, He, Chuan C, Geussens, Theo
• Format: Patent
• Language: English
• Published: 28.09.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; COMPOSITIONS BASED THEREON; CONDUCTORS; ELECTRICITY; INSULATORS; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP

In various embodiments, a bimodal polyethylene may include a high molecular weight component and a low molecular weight component. The bimodal polyethylene may have a density of from 0.933 grams per centimeter (g/cm3) to 0.960 g/cm3, a melt index (I2) of from 0.3 decigrams per minute (dg/min) to 1.2 dg/min, a melt flow ratio (MFR21) greater than 80.0, a molecular weight distribution (Mw/Mn) greater than 10, a reverse comonomer distribution, and a shear thinning index of from 5.0 to 20.0. Methods for producing the bimodal polyethylene, articles manufactured from the bimodal polyethylene are also provided.