SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MANUFACTURING METHOD

• Main Authors: Sugawara, Nobuyuki, Suzuki, Ryo, Kambayashi, Asuka
• Format: Patent
• Language: English
• Published: 21.09.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Information regarding a semiconductor package is written on a stiffener and not on an upper surface of a semiconductor chip. The stiffener is positioned outside an outer edge of the semiconductor chip and inside an outer edge of a package base material. Further, a thermally conductive material havin...