SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MANUFACTURING METHOD
Information regarding a semiconductor package is written on a stiffener and not on an upper surface of a semiconductor chip. The stiffener is positioned outside an outer edge of the semiconductor chip and inside an outer edge of a package base material. Further, a thermally conductive material havin...
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| Main Authors | , , |
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| Format | Patent |
| Language | English |
| Published |
21.09.2023
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| Subjects | |
| Online Access | Get full text |
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| Abstract | Information regarding a semiconductor package is written on a stiffener and not on an upper surface of a semiconductor chip. The stiffener is positioned outside an outer edge of the semiconductor chip and inside an outer edge of a package base material. Further, a thermally conductive material having fluidity is disposed between the upper surface of the semiconductor chip and a radiator. Therefore, the semiconductor chip provides high cooling performance. |
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| AbstractList | Information regarding a semiconductor package is written on a stiffener and not on an upper surface of a semiconductor chip. The stiffener is positioned outside an outer edge of the semiconductor chip and inside an outer edge of a package base material. Further, a thermally conductive material having fluidity is disposed between the upper surface of the semiconductor chip and a radiator. Therefore, the semiconductor chip provides high cooling performance. |
| Author | Kambayashi, Asuka Sugawara, Nobuyuki Suzuki, Ryo |
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| RelatedCompanies | Sony Interactive Entertainment Inc |
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| Snippet | Information regarding a semiconductor package is written on a stiffener and not on an upper surface of a semiconductor chip. The stiffener is positioned... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MANUFACTURING METHOD |
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