SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MANUFACTURING METHOD

Information regarding a semiconductor package is written on a stiffener and not on an upper surface of a semiconductor chip. The stiffener is positioned outside an outer edge of the semiconductor chip and inside an outer edge of a package base material. Further, a thermally conductive material havin...

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Bibliographic Details
Main Authors Sugawara, Nobuyuki, Suzuki, Ryo, Kambayashi, Asuka
Format Patent
LanguageEnglish
Published 21.09.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Information regarding a semiconductor package is written on a stiffener and not on an upper surface of a semiconductor chip. The stiffener is positioned outside an outer edge of the semiconductor chip and inside an outer edge of a package base material. Further, a thermally conductive material having fluidity is disposed between the upper surface of the semiconductor chip and a radiator. Therefore, the semiconductor chip provides high cooling performance.
Bibliography:Application Number: US202118044847