MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS
A member for semiconductor manufacturing apparatus includes: a ceramic plate having a wafer placement surface on its upper surface; and a porous plug that is disposed in a plug insertion hole penetrating the ceramic plate in a up-down direction, and allows a gas to flow, wherein the porous plug has...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
21.09.2023
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Subjects | |
Online Access | Get full text |
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Abstract | A member for semiconductor manufacturing apparatus includes: a ceramic plate having a wafer placement surface on its upper surface; and a porous plug that is disposed in a plug insertion hole penetrating the ceramic plate in a up-down direction, and allows a gas to flow, wherein the porous plug has a first porous member exposed to the wafer placement surface, and a second porous member having an upper surface covered by the first porous member, the first porous member is higher in purity and smaller in thickness than the second porous member, and the second porous member is higher in porosity than the first porous member. |
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AbstractList | A member for semiconductor manufacturing apparatus includes: a ceramic plate having a wafer placement surface on its upper surface; and a porous plug that is disposed in a plug insertion hole penetrating the ceramic plate in a up-down direction, and allows a gas to flow, wherein the porous plug has a first porous member exposed to the wafer placement surface, and a second porous member having an upper surface covered by the first porous member, the first porous member is higher in purity and smaller in thickness than the second porous member, and the second porous member is higher in porosity than the first porous member. |
Author | OGISO, Yusuke KUNO, Tatsuya INOUE, Seiya NAGAE, Tomoki YOTO, Takuya |
Author_xml | – fullname: INOUE, Seiya – fullname: KUNO, Tatsuya – fullname: NAGAE, Tomoki – fullname: YOTO, Takuya – fullname: OGISO, Yusuke |
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Notes | Application Number: US202218052589 |
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Snippet | A member for semiconductor manufacturing apparatus includes: a ceramic plate having a wafer placement surface on its upper surface; and a porous plug that is... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS |
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