SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE

• Main Authors: Chen, Tai-Yu, Song, Isabella, Yu, Ta-Jen, Tsai, Wen-Chin, Lin, Shih-Chin
• Format: Patent
• Language: English
• Published: 07.09.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor package includes a bottom substrate and a top substrate space apart from the bottom substrate such that the bottom substrate and the top substrate define a gap therebetween. A logic die is mounted on a top surface of the bottom substrate in a flip-chip fashion. The logic die has a th...