Packaged Electronic Device With Film Isolated Power Stack

• Main Authors: Lopez, Osvaldo Jorge, Luo, Tianyi, Noquil, Jonathan Almeria
• Format: Patent
• Language: English
• Published: 24.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a sec...