Packaged Electronic Device With Film Isolated Power Stack
A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a sec...
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| Main Authors | , , |
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| Format | Patent |
| Language | English |
| Published |
24.08.2023
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a second side of the second semiconductor die, and a package structure that encloses the first semiconductor die, and the second semiconductor die, where the package structure includes a side that exposes a portion of a second side of the first conductive plate. |
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| AbstractList | A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a second side of the second semiconductor die, and a package structure that encloses the first semiconductor die, and the second semiconductor die, where the package structure includes a side that exposes a portion of a second side of the first conductive plate. |
| Author | Luo, Tianyi Lopez, Osvaldo Jorge Noquil, Jonathan Almeria |
| Author_xml | – fullname: Lopez, Osvaldo Jorge – fullname: Luo, Tianyi – fullname: Noquil, Jonathan Almeria |
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| Notes | Application Number: US202318306808 |
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| Snippet | A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Packaged Electronic Device With Film Isolated Power Stack |
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