BEND COMPENSATION FOR CONDUCTIVE TRACES ON PRINTED CIRCUIT BOARDS

A printed circuit board includes a dielectric substrate; first and second conductive traces disposed on the dielectric substrate; and a compensation structure disposed in the first conductive trace. The compensation structure includes a compensation segment connected in line with the first conductiv...

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Bibliographic Details
Main Authors Hammoodi, Ali, Rowlands, Michael
Format Patent
LanguageEnglish
Published 10.08.2023
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A printed circuit board includes a dielectric substrate; first and second conductive traces disposed on the dielectric substrate; and a compensation structure disposed in the first conductive trace. The compensation structure includes a compensation segment connected in line with the first conductive trace; and a dielectric layer on all or part of the compensation segment. The first and second conductive traces may form a differential signal pair. The compensation segment may limit one or more of signal skew, mode conversion from differential mode to common mode, and impedance variations caused by a bend in the differential signal pair.
Bibliography:Application Number: US202318135570