METHOD AND APPARATUS FOR COMPACTING A POWDER LAYER
The present disclosure pertains to an improved method and apparatus for compacting a powder layer. An exemplary method comprises placing the substrate on a first plate, placing a second plate over the powder layer so that the substrate and the powder layer are sandwiched between the first plate and...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
20.07.2023
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Subjects | |
Online Access | Get full text |
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