BEOL INTERCONNECT SUBTRACTIVE ETCH SUPER VIA

• Main Authors: Clevenger, Lawrence A, Rizzolo, Michael, Bhosale, Prasad, Lanzillo, Nicholas Anthony
• Format: Patent
• Language: English
• Published: 08.06.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Semiconductor devices including a super via connection between levels are provided. The semiconductor device can include a first interlevel dielectric layer, a back-end-of-line (BEOL) interconnect structure disposed in the first interlevel dielectric layer, a second interlevel dielectric layer dispo...