POLISH PAD REPLACING APPARATUS

A polish pad replacing apparatus includes a polish spindle loaded with a first polish pad, a first roller movable reciprocally under the polish spindle, a clamping element and a position sensor. The clamping element, disposed at the first roller, is to clamp or release the first polish pad. In repla...

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Main Authors SU, CHUN-HSIEN, SU, CHIHIEH, CHAO, KOIEH
Format Patent
LanguageEnglish
Published 25.05.2023
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Abstract A polish pad replacing apparatus includes a polish spindle loaded with a first polish pad, a first roller movable reciprocally under the polish spindle, a clamping element and a position sensor. The clamping element, disposed at the first roller, is to clamp or release the first polish pad. In replacing the first polish pad, a controller moves the polish spindle to a replacing position, the position sensor detects the polish spindle and if positive, have the controller to moves the first roller to insert the clamping element between the polish spindle and the first polish pad so as to clamp an edge of the first polish pad, the first roller is then moved to peel the first polish pad off, and then the first roller is moved to paste a second polish pad onto the polish spindle.
AbstractList A polish pad replacing apparatus includes a polish spindle loaded with a first polish pad, a first roller movable reciprocally under the polish spindle, a clamping element and a position sensor. The clamping element, disposed at the first roller, is to clamp or release the first polish pad. In replacing the first polish pad, a controller moves the polish spindle to a replacing position, the position sensor detects the polish spindle and if positive, have the controller to moves the first roller to insert the clamping element between the polish spindle and the first polish pad so as to clamp an edge of the first polish pad, the first roller is then moved to peel the first polish pad off, and then the first roller is moved to paste a second polish pad onto the polish spindle.
Author CHAO, KOIEH
SU, CHIHIEH
SU, CHUN-HSIEN
Author_xml – fullname: SU, CHUN-HSIEN
– fullname: SU, CHIHIEH
– fullname: CHAO, KOIEH
BookMark eNrjYmDJy89L5WSQC_D38Qz2UAhwdFEIcg3wcXT29HNXcAwIcAxyDAkN5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGxoamFmbGJo6GxsSpAgATxyQF
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US2023158634A1
GroupedDBID EVB
ID FETCH-epo_espacenet_US2023158634A13
IEDL.DBID EVB
IngestDate Fri Jul 19 12:50:27 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US2023158634A13
Notes Application Number: US202217965497
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230525&DB=EPODOC&CC=US&NR=2023158634A1
ParticipantIDs epo_espacenet_US2023158634A1
PublicationCentury 2000
PublicationDate 20230525
PublicationDateYYYYMMDD 2023-05-25
PublicationDate_xml – month: 05
  year: 2023
  text: 20230525
  day: 25
PublicationDecade 2020
PublicationYear 2023
RelatedCompanies Industrial Technology Research Institute
RelatedCompanies_xml – name: Industrial Technology Research Institute
Score 3.4652822
Snippet A polish pad replacing apparatus includes a polish spindle loaded with a first polish pad, a first roller movable reciprocally under the polish spindle, a...
SourceID epo
SourceType Open Access Repository
SubjectTerms DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
Title POLISH PAD REPLACING APPARATUS
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230525&DB=EPODOC&locale=&CC=US&NR=2023158634A1
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR1dS8Mw8BhT1DeditM5Ckrfiq5N1_pQpOuHU1wb-iF7G02TgiBzuIp_32vodE97S3JwSQ4u930BuLU540xURCP6iGmEM0OzuVFoQghUgIvinsusylk0nubkZW7OO_CxqYWRfUJ_ZHNE5KgS-b2W7_Xq34nly9zK9R17x6XPxzBzfLW1jlGfNnVT9SdOQGM_9lTPc_JUjRIJG5n22CAu2kp7qEhbTQJY8DZp6lJW20IlPIZ9iviW9Ql0xLIHh97m77UeHMzakDcOW-5bn8KQxo1_SaGuryQBfXW95-hJcSl1EzfL0zO4CYPMm2q40eLvXos83T6VcQ5dtPjFBSgVsYjglj5G5idlyR5MxouCERtpWVmF6MNgF6bL3eArOGqmTQhcNwfQrb--xTVK1poNJUF-AZvdea4
link.rule.ids 230,309,783,888,25578,76884
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFOebTsWPOQtK34quTT98KNK1nZtuXVhb2VtpmhQEmcNV_Pe9hk33tLeQg0ty8Mt95S4Adw5nnImSaETvMY1wZmgON3JNCIEGcJ4_cPmqchJZw5S8zM15Az42tTCyT-iPbI6IiCoQ75W8r5f_QaxAvq1c3bN3nPp8GiRuoK69Y7SnTd1Ug74b0mkw9VXfd9NYjWaS1jMdyyAe-kp7aGQ7daf98K1f16Ust5XK4Aj2KfJbVMfQEIs2tPzN32ttOJisU944XKNvdQJdOq3jSwr1AmUW0rHnj6JnxaPUm3lJGp_C7SBM_KGGC2V_58rSeHtXxhk00eMX56CUxCaC27qF4CdFwR5NxvOcEQdlWdq5uIDOLk6Xu8k30Bomk3E2HkWvV3BYk-p0uG52oFl9fYtr1LIV60rh_AJ393ye
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=POLISH+PAD+REPLACING+APPARATUS&rft.inventor=SU%2C+CHUN-HSIEN&rft.inventor=SU%2C+CHIHIEH&rft.inventor=CHAO%2C+KOIEH&rft.date=2023-05-25&rft.externalDBID=A1&rft.externalDocID=US2023158634A1