Die Interconnect Substrate, an Electrical Device and a Method for Forming a Die Interconnect Substrate

• Main Authors: BOYAPATI, Sri Ranga Sai Sai, MAY, Robert Alan, DARMAWIKARTA, Kristof
• Format: Patent
• Language: English
• Published: 11.05.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A die interconnect substrate comprises a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate comprises a multilayer substrate structure comprising a substrate interconn...