OLIGOMER, COMPOSITION, PACKAGING STRUCTURE, AND METHOD OF DISASSEMBLING PACKAGING STRUCTURE

• Main Authors: TSENG, Chi-Fu, SHIEH, Tien-Shou, JENG, Jauder, CHOU, Chin-Hui
• Format: Patent
• Language: English
• Published: 20.04.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure ofwherein X is -O-,and each R1 is independently CH3, CH2F, CHF2, or CF3. A composition containing the oligomer can be cured to serve as a sealant...