CHAMBERS AND COATINGS FOR REDUCING BACKSIDE DAMAGE

• Main Authors: Firouzdor, Vahid, Tedeschi, Leonard M, Schwarz, Benjamin CE, Banda, Sumanth, Wang, Changgong, Ramaswamy, Kartik, Kou, Teng-Fang
• Format: Patent
• Language: English
• Published: 16.03.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Methods of semiconductor processing may include forming a plasma of a carbon-containing material within a processing region of a semiconductor processing chamber. The methods may include depositing a carbon-containing material on a backside of a substrate housed within the processing region of the s...