INTEGRATED DRY PROCESSES FOR PATTERNING RADIATION PHOTORESIST PATTERNING

• Main Authors: Yu, Jengyi, Tan, Samantha S.H, Alvi, Mohammed Haroon, Weidman, Timothy William, Wise, Richard, Kanakasabapathy, Sivananda Krishnan, Hubacek, Jerome S, LaVoie, Adrien, Pan, Yang, Gottscho, Richard Alan, Lin, Qinghuang
• Format: Patent
• Language: English
• Published: 09.02.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES

Methods for making thin-films on semiconductor substrates, may be patterned using EUV, include: depositing the organometallic polymer-like material onto the surface of the semiconductor substrate, exposing the surface to EUV to form a pattern, and developing the pattern for later transfer to underlying layers. The depositing operations may be performed by chemical vapor deposition (CVD), atomic layer deposition (ALD), and ALD with a CVD component, such as a discontinuous, ALD-like process in which metal precursors and counter-reactants are separated in either time or space.