METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL LOAD DISTRIBUTION OF INTEGRATED CIRCUIT PACKAGES

Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a heatsink, a base of the heatsink to be thermally coupled to a semiconductor device, and a rigid plate to be coupled to the semiconductor...

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Main Authors Shia, David, Miele, Ralph, Ahuja, Sandeep, Smalley, Jeffory, Geng, Phil
Format Patent
LanguageEnglish
Published 09.02.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a heatsink, a base of the heatsink to be thermally coupled to a semiconductor device, and a rigid plate to be coupled to the semiconductor device and the base of the heatsink, the rigid plate stiffer than the base, the rigid plate distinct from a bolster plate to which the heatsink is to be coupled.
AbstractList Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a heatsink, a base of the heatsink to be thermally coupled to a semiconductor device, and a rigid plate to be coupled to the semiconductor device and the base of the heatsink, the rigid plate stiffer than the base, the rigid plate distinct from a bolster plate to which the heatsink is to be coupled.
Author Ahuja, Sandeep
Miele, Ralph
Geng, Phil
Smalley, Jeffory
Shia, David
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Snippet Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus...
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ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL LOAD DISTRIBUTION OF INTEGRATED CIRCUIT PACKAGES
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