SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor package device includes a substrate, an electronic component, and a thermal conductive layer. The electronic component is disposed on the substrate and includes a first surface facing away from the substrate. The thermal conductive layer is disposed above the first surface of the ele...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
26.01.2023
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Subjects | |
Online Access | Get full text |
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