SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR

• Main Author: Tang, Jinbang
• Format: Patent
• Language: English
• Published: 29.12.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method of forming a packaged semiconductor device includes attaching a backside surface of a semiconductor die to a major surface of a package substrate. A first conductive connector is formed over a portion of an active surface of the semiconductor die and a portion of the major surface of the pa...