SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR
A method of forming a packaged semiconductor device includes attaching a backside surface of a semiconductor die to a major surface of a package substrate. A first conductive connector is formed over a portion of an active surface of the semiconductor die and a portion of the major surface of the pa...
Saved in:
| Main Author | |
|---|---|
| Format | Patent |
| Language | English |
| Published |
29.12.2022
|
| Subjects | |
| Online Access | Get full text |
Cover
Loading…
| Abstract | A method of forming a packaged semiconductor device includes attaching a backside surface of a semiconductor die to a major surface of a package substrate. A first conductive connector is formed over a portion of an active surface of the semiconductor die and a portion of the major surface of the package substrate. A first conductive connection between a first bond pad of the semiconductor die and a first substrate pad of the package substrate is formed by way of the first conductive connector. A bond wire connects a second bond pad of the semiconductor die to a second substrate pad of the package substrate. The first bond pad located between the second bond pad and an edge of the semiconductor die. |
|---|---|
| AbstractList | A method of forming a packaged semiconductor device includes attaching a backside surface of a semiconductor die to a major surface of a package substrate. A first conductive connector is formed over a portion of an active surface of the semiconductor die and a portion of the major surface of the package substrate. A first conductive connection between a first bond pad of the semiconductor die and a first substrate pad of the package substrate is formed by way of the first conductive connector. A bond wire connects a second bond pad of the semiconductor die to a second substrate pad of the package substrate. The first bond pad located between the second bond pad and an edge of the semiconductor die. |
| Author | Tang, Jinbang |
| Author_xml | – fullname: Tang, Jinbang |
| BookMark | eNrjYmDJy89L5WQwDHb19XT293MJdQ7xD1JwcQ3zdHZVcAwGCjv5RCo4-rko-LqGePi7KIR4uAa5uvkH8TCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-NBgIwMjIxNDUwsTE0dDY-JUAQD3iylM |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| ExternalDocumentID | US2022415844A1 |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_US2022415844A13 |
| IEDL.DBID | EVB |
| IngestDate | Fri Jul 19 12:57:28 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_US2022415844A13 |
| Notes | Application Number: US202217822998 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221229&DB=EPODOC&CC=US&NR=2022415844A1 |
| ParticipantIDs | epo_espacenet_US2022415844A1 |
| PublicationCentury | 2000 |
| PublicationDate | 20221229 |
| PublicationDateYYYYMMDD | 2022-12-29 |
| PublicationDate_xml | – month: 12 year: 2022 text: 20221229 day: 29 |
| PublicationDecade | 2020 |
| PublicationYear | 2022 |
| RelatedCompanies | NXP USA, INC |
| RelatedCompanies_xml | – name: NXP USA, INC |
| Score | 3.4490921 |
| Snippet | A method of forming a packaged semiconductor device includes attaching a backside surface of a semiconductor die to a major surface of a package substrate. A... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD THEREFOR |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221229&DB=EPODOC&locale=&CC=US&NR=2022415844A1 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR1dS8Mw8BhT1DeditMpAaVvRZelXfcwpE1Sqth29GPMp7FuLQjSDVfx73spm-5pb8kdXJKD-8rlLgAPKldFuwXKd59mOmO0rw-KGdV7zGBFzmZPM0PVDvuB6aXsdWJMGvC5rYWp-4T-1M0RUaLmKO9Vra9X_5dYon5buX7MPhC0fHaTodA20TFFRYwBtHCGchSKkGucD9NYC6Iah7bKYszGWOlAOdKq074cO6ouZbVrVNxTOBwhvbI6g0ZetuCYb_9ea8GRv0l543Ajfetz6MaKaWEgUp6EERFy_MIlsWMEO2_vxA4E8WXihYIknowkxncXcO_KhHs6rj39O-o0jXc32ruEZrks8ysgA3OOjlCB7sZigT6PmeWGUZiWmZnWopezrA2dfZSu96Nv4ERN1TMNOuhAs_r6zm_R2FbZXc2jX9W6fIQ |
| link.rule.ids | 230,309,786,891,25594,76904 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFOebTsWPqQVlb0XXpl8PQ7Yko9N-jH6M-TTatQVBuuEq_vteyqZ72lvIwSU5-OXul-QuAI_irkrpFYhvQ0llQhRDtopEkVWikSInyXOiidxh19PtmLzOtFkDPre5MHWd0J-6OCIiaoF4r-r9evV_iMXqt5Xrp_QDu5Yvo6jPuht2rOBGjASaDft84jOfdintx2HXC2oZ-iqTkAFypQMDSaGotM-nQ5GXstp1KqMTOJygvrI6hUZetqFFt3-vteHI3Vx5Y3ODvvUZ9EJhNN9jMY38QGJ8OqZcGoTYPXTepYHHJJdHts-kyOYBR353Dg8jHlFbxrHnf0udx-HuRNULaJbLMr8EydIXGAgVGG5kGcY8epprWqGbeqqbmZqT9Ao6-zRd7xffQ8uOXGfujL23GzgWIvFkQ7E60Ky-vvNbdLxVelfb6xfOJ39v |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=SEMICONDUCTOR+DEVICE+ASSEMBLY+AND+METHOD+THEREFOR&rft.inventor=Tang%2C+Jinbang&rft.date=2022-12-29&rft.externalDBID=A1&rft.externalDocID=US2022415844A1 |