METHOD AND SYSTEM FOR BONDING

A method of forming a semiconductor device includes mounting a first wafer on a first wafer chuck and mounting a second wafer on a second wafer chuck. A push pin is extended through the first wafer chuck to distort the first wafer. A surface profile distortion of the first wafer is measured with a f...

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Bibliographic Details
Main Authors Chang, Chieh, Yeo, Yee-Chia, Chang, Huicheng, Sheu, Jyh-Cherng
Format Patent
LanguageEnglish
Published 17.11.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of forming a semiconductor device includes mounting a first wafer on a first wafer chuck and mounting a second wafer on a second wafer chuck. A push pin is extended through the first wafer chuck to distort the first wafer. A surface profile distortion of the first wafer is measured with a first surface profiler. A vacuum pressure of a vacuum zone on the first wafer chuck is adjusted using a measurement of the surface profile distortion. The first wafer chuck is moved towards the second wafer chuck so that the first wafer physically contacts the second wafer, and the first wafer is bonded to the second wafer.
Bibliography:Application Number: US202117532104