METHOD FOR MICROSTRUCTURE MODIFICATION OF CONDUCTING LINES

A method for microstructure modification of conducting lines is provided. An electroplating process is performed to deposit the metal thin film/conducting line(s) with a face-centered cubic (FCC) structure and a preferred crystallographic orientation over a surface of a substrate. The metal thin fil...

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Main Authors PAN, Chih Pin, CHANG, Chih Hao, HO, Cheng EN, LIN, Ping Chou, LEE, Cheng Yu
Format Patent
LanguageEnglish
Published 15.09.2022
Subjects
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SEMICONDUCTOR DEVICES
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Abstract A method for microstructure modification of conducting lines is provided. An electroplating process is performed to deposit the metal thin film/conducting line(s) with a face-centered cubic (FCC) structure and a preferred crystallographic orientation over a surface of a substrate. The metal thin film/ conducting line(s) is subsequently subjected to a thermal annealing process to modify its microstructure with the grain sizes in a range of 5 μm to 100 μm. The thermal annealing process is conducted at the temperature of above 25 degrees Celsius and below 240 degrees Celsius.
AbstractList A method for microstructure modification of conducting lines is provided. An electroplating process is performed to deposit the metal thin film/conducting line(s) with a face-centered cubic (FCC) structure and a preferred crystallographic orientation over a surface of a substrate. The metal thin film/ conducting line(s) is subsequently subjected to a thermal annealing process to modify its microstructure with the grain sizes in a range of 5 μm to 100 μm. The thermal annealing process is conducted at the temperature of above 25 degrees Celsius and below 240 degrees Celsius.
Author LEE, Cheng Yu
LIN, Ping Chou
CHANG, Chih Hao
HO, Cheng EN
PAN, Chih Pin
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Snippet A method for microstructure modification of conducting lines is provided. An electroplating process is performed to deposit the metal thin film/conducting...
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SubjectTerms APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SEMICONDUCTOR DEVICES
Title METHOD FOR MICROSTRUCTURE MODIFICATION OF CONDUCTING LINES
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