SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

• Main Authors: KIM, TAEHEON, CHO, YUNRAE, OH, EUNKYUL, HAN, SEUNGHUN
• Format: Patent
• Language: English
• Published: 18.08.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present disclosure relates to a semiconductor package and a manufacturing method thereof. The method includes stacking semiconductor chips using a thermo-compression bonding (TCB) method, where defects are minimized for increased reliability. The semiconductor package includes an interface chip...