CONDUIT INSERTS FOR ENCAPSULANT COMPOUND FORMULATION KNEADING AND ENCAPSULATION BACK-END ASSEMBLY PROCESSES

An encapsulant compound apparatus, includes a mechanical operator, and an insert disposed on a surface of the mechanical operator. The insert operates to capture foreign material in the encapsulant compound.

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Bibliographic Details
Main Authors Low, Boon Yew, Chopin, Sheila F, Lakhera, Nishant
Format Patent
LanguageEnglish
Published 11.08.2022
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Abstract An encapsulant compound apparatus, includes a mechanical operator, and an insert disposed on a surface of the mechanical operator. The insert operates to capture foreign material in the encapsulant compound.
AbstractList An encapsulant compound apparatus, includes a mechanical operator, and an insert disposed on a surface of the mechanical operator. The insert operates to capture foreign material in the encapsulant compound.
Author Lakhera, Nishant
Chopin, Sheila F
Low, Boon Yew
Author_xml – fullname: Low, Boon Yew
– fullname: Chopin, Sheila F
– fullname: Lakhera, Nishant
BookMark eNqNir0OgjAURjvo4N87NHEmgRIe4FIu2gC3hLaDEyGmLhogwfeP1Rhnpy_fOWfLVuM0-g27S02FU5YrMthZw0vdcSQJrXE1kOVSN612VLxFE5BVmnhFCIWiE4cgfvVH5SCrCAMGY7DJ6wtvOy0xHLNn69vwWPzhuzt2LNHKc-TnqffLPFz96J-9MyIWQmRxGieQpP9VL0cfOXQ
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US2022250301A1
GroupedDBID EVB
ID FETCH-epo_espacenet_US2022250301A13
IEDL.DBID EVB
IngestDate Fri Jul 19 13:03:23 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US2022250301A13
Notes Application Number: US202117173130
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220811&DB=EPODOC&CC=US&NR=2022250301A1
ParticipantIDs epo_espacenet_US2022250301A1
PublicationCentury 2000
PublicationDate 20220811
PublicationDateYYYYMMDD 2022-08-11
PublicationDate_xml – month: 08
  year: 2022
  text: 20220811
  day: 11
PublicationDecade 2020
PublicationYear 2022
RelatedCompanies NXP USA, Inc
RelatedCompanies_xml – name: NXP USA, Inc
Score 3.4167807
Snippet An encapsulant compound apparatus, includes a mechanical operator, and an insert disposed on a surface of the mechanical operator. The insert operates to...
SourceID epo
SourceType Open Access Repository
SubjectTerms AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Title CONDUIT INSERTS FOR ENCAPSULANT COMPOUND FORMULATION KNEADING AND ENCAPSULATION BACK-END ASSEMBLY PROCESSES
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220811&DB=EPODOC&locale=&CC=US&NR=2022250301A1
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1bS8MwFA5jivqmU_EyJaD0rUjv68OQNs3c3JqWtZX5NNIbiNINV_Hvexq2uae9JecLIbeTk-_khtCjwc2yyG1T5oXWEBQjlznXgbgavV5qa4ZlZeK0BTOHif46M2Yt9LW5CyPeCf0VjyOCRmWg77WYr5f_TixPnK1cPaUfIFo8D-K-J63ZsaqChVMkz-3TMPACIhHSTyKJTQUG1h6GswNc6QAW0lajD_TNbe6lLHeNyuAUHYaQX1WfoVZRddAx2fy91kFH_nrLG4Jr7Vudo08SMC8ZxRgYN53GEQYGhykjThglE4fFmAR-GCTMawAfRI37CY8ZdbwRe8EOANvUAnIdMpYpiJ0oor47ecfhNCDQJTS6QA8DGpOhDKWebxtpnkS7VdQuUbtaVMUVwraVmrwsdTNTcl0pbV5Yha5nOs9VrnJLu0bdfTnd7Idv0UkTbbysitJF7fr7p7gDM12n96J1_wDWgY2p
link.rule.ids 230,309,783,888,25576,76876
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1bS8MwFA5jivNNp-JlakDpW5He14chbZq5uTYtayvzaaQ3EKUbruLf97Rsc097C-cLITnJycl3ckPoUeN6kWemLvJcqQmKlomcq0BctX4_MRXNMNLmtAXTR7H6OtNmLfS1uQvTvBP62zyOCBaVgr1XzXy9_A9iOc3ZytVT8gGixfMwGjjCmh3LMng4SXDsAQ18xycCIYM4FNi0wcDbw3C2gCsdwCLbqO2Bvtn1vZTlrlMZnqDDAMorq1PUyssu6pDN32tddOStt7whuba-1Rn6JD5z4nGEgXHTaRRiYHCYMmIFYexaLMLE9wI_Zk4NeCCqw094wqjljNkLtgDY5m4g2yITkYLYCkPq2e47DqY-gS6h4Tl6GNKIjESo9XyrpHkc7jZRuUDtclHmlwibRqLzolD1VMpUqTB5buSqmqo8k7nMDeUK9faVdL0fvkedUeS5c3fMJjfouIbqiKsk9VC7-v7Jb8FlV8ldo-k_qLKQnA
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=CONDUIT+INSERTS+FOR+ENCAPSULANT+COMPOUND+FORMULATION+KNEADING+AND+ENCAPSULATION+BACK-END+ASSEMBLY+PROCESSES&rft.inventor=Low%2C+Boon+Yew&rft.inventor=Chopin%2C+Sheila+F&rft.inventor=Lakhera%2C+Nishant&rft.date=2022-08-11&rft.externalDBID=A1&rft.externalDocID=US2022250301A1