FORMULATIONS FOR CHEMICAL MECHANICAL POLISHING PADS WITH HIGH PLANARIZATION EFFICIENCY AND CMP PADS MADE THEREWITH

• Main Authors: Barton, Bryan E, Brugarolas Brufau, Teresa
• Format: Patent
• Language: English
• Published: 21.07.2022
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; POLISHING; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

CMP polishing pads or layers made from a polyurethane reaction product of a reaction mixture comprising (i) a liquid aromatic isocyanate component comprising one or more aromatic diisocyanates or a linear aromatic isocyanate-terminated urethane prepolymer, and (ii) a liquid polyol component comprisi...