IMPLANTABLE SENSOR ELECTRONICS PACKAGING

An implantable device includes a substrate and protective cover that cooperate to define an enclosed sensor volume. A sealed enclosure is provided within the sensor volume, with an electronic component assembly (ECA) being located within the sealed enclosure. A flexible circuit board assembly (FCBA)...

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Main Authors Dlugos, Dan, Shahriari, Navid, Op de Beeck, Maria, Sheikhi, Erfan, Fichman, Mark, Walser, Jochen, Vu, Binh Bao, Mikhail, George, Lee, Seulki
Format Patent
LanguageEnglish
Published 16.06.2022
Subjects
DIAGNOSIS
HUMAN NECESSITIES
HYGIENE
IDENTIFICATION
MEDICAL OR VETERINARY SCIENCE
SURGERY
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Summary:An implantable device includes a substrate and protective cover that cooperate to define an enclosed sensor volume. A sealed enclosure is provided within the sensor volume, with an electronic component assembly (ECA) being located within the sealed enclosure. A flexible circuit board assembly (FCBA) is electrically coupled with the ECA through a wall of the sealed enclosure. At least one transducer is provided on the FCBA in contact with the substrate, and the FCBA is held apart from the enclosure via a polymeric spacer provided therebetween. An inert polymer fill is provided within the sensor volume external to the enclosure.
Bibliography:Application Number: US202017123101