PRINTED CIRCUIT BOARD
A printed circuit board includes a first insulating layer disposed on a flexible region and a rigid region; and a first wiring layer disposed on one surface of the first insulating layer in the rigid region and the flexible region. A thickness of the first wiring layer in at least a portion of the r...
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| Main Authors | , , , |
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| Format | Patent |
| Language | English |
| Published |
24.03.2022
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A printed circuit board includes a first insulating layer disposed on a flexible region and a rigid region; and a first wiring layer disposed on one surface of the first insulating layer in the rigid region and the flexible region. A thickness of the first wiring layer in at least a portion of the rigid region is greater than a thickness of the first wiring layer in the flexible region. |
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| AbstractList | A printed circuit board includes a first insulating layer disposed on a flexible region and a rigid region; and a first wiring layer disposed on one surface of the first insulating layer in the rigid region and the flexible region. A thickness of the first wiring layer in at least a portion of the rigid region is greater than a thickness of the first wiring layer in the flexible region. |
| Author | SIM, Sang Hyun KIM, Jung Soo HA, Chang Min BYUN, Dae Jung |
| Author_xml | – fullname: BYUN, Dae Jung – fullname: HA, Chang Min – fullname: SIM, Sang Hyun – fullname: KIM, Jung Soo |
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| Notes | Application Number: US202017124814 |
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| RelatedCompanies | SAMSUNG ELECTRO-MECHANICS CO., LTD |
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| Snippet | A printed circuit board includes a first insulating layer disposed on a flexible region and a rigid region; and a first wiring layer disposed on one surface of... |
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| SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| Title | PRINTED CIRCUIT BOARD |
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