RECESSED PORTION IN A SUBSTRATE AND METHOD OF FORMING THE SAME

A recessed portion in a semiconductor substrate and a method of forming the same are provided. The method comprises: forming a mask on the semiconductor substrate; forming a protection layer on a top surface of the mask and on at least one sidewall of the mask, and on at least one surface of the sem...

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Bibliographic Details
Main Authors CHUANG, Shao Hsuan, CHANG, Huang-Hsien
Format Patent
LanguageEnglish
Published 10.02.2022
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