RECESSED PORTION IN A SUBSTRATE AND METHOD OF FORMING THE SAME
A recessed portion in a semiconductor substrate and a method of forming the same are provided. The method comprises: forming a mask on the semiconductor substrate; forming a protection layer on a top surface of the mask and on at least one sidewall of the mask, and on at least one surface of the sem...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
10.02.2022
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Subjects | |
Online Access | Get full text |
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