FLUX AND SOLDER PASTE

A flux comprising an organic acid; a solvent; and polyoxyethylene behenyl alcohol having an average number of moles of ethylene oxide added of 7 to 40 mol.

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Bibliographic Details
Main Authors Sugii, Hiroshi, Takahashi, Atsumi, Kawasaki, Hiroyoshi, Maruko, Daisuke, Shirakawa, Ayaka, Shiratori, Masato
Format Patent
LanguageEnglish
Published 16.12.2021
Subjects
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Abstract A flux comprising an organic acid; a solvent; and polyoxyethylene behenyl alcohol having an average number of moles of ethylene oxide added of 7 to 40 mol.
AbstractList A flux comprising an organic acid; a solvent; and polyoxyethylene behenyl alcohol having an average number of moles of ethylene oxide added of 7 to 40 mol.
Author Takahashi, Atsumi
Shirakawa, Ayaka
Sugii, Hiroshi
Kawasaki, Hiroyoshi
Maruko, Daisuke
Shiratori, Masato
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– fullname: Takahashi, Atsumi
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– fullname: Maruko, Daisuke
– fullname: Shirakawa, Ayaka
– fullname: Shiratori, Masato
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Snippet A flux comprising an organic acid; a solvent; and polyoxyethylene behenyl alcohol having an average number of moles of ethylene oxide added of 7 to 40 mol.
SourceID epo
SourceType Open Access Repository
SubjectTerms CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
Title FLUX AND SOLDER PASTE
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