Affixation Film for Printed Wiring Board
An affixation film 101 for a printed wiring board includes a circuit pattern concealing layer 112, and an adhesive layer 111 put on top of the circuit pattern concealing layer 112. An opposite surface of the circuit pattern concealing layer 112 from the adhesive layer 111 has an Rku of 2.5-3.0.
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
16.09.2021
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| Subjects | |
| Online Access | Get full text |
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| Abstract | An affixation film 101 for a printed wiring board includes a circuit pattern concealing layer 112, and an adhesive layer 111 put on top of the circuit pattern concealing layer 112. An opposite surface of the circuit pattern concealing layer 112 from the adhesive layer 111 has an Rku of 2.5-3.0. |
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| AbstractList | An affixation film 101 for a printed wiring board includes a circuit pattern concealing layer 112, and an adhesive layer 111 put on top of the circuit pattern concealing layer 112. An opposite surface of the circuit pattern concealing layer 112 from the adhesive layer 111 has an Rku of 2.5-3.0. |
| Author | WATANABE, Masahiro ISHIOKA, Sougo |
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| Notes | Application Number: US201917256931 |
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| PublicationDateYYYYMMDD | 2021-09-16 |
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| PublicationYear | 2021 |
| RelatedCompanies | Tatsuta Electric Wire & Cable Co., Ltd |
| RelatedCompanies_xml | – name: Tatsuta Electric Wire & Cable Co., Ltd |
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| Snippet | An affixation film 101 for a printed wiring board includes a circuit pattern concealing layer 112, and an adhesive layer 111 put on top of the circuit pattern... |
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| SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| Title | Affixation Film for Printed Wiring Board |
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