INSPECTION METHOD AND PLASMA PROCESSING APPARATUS
An inspection method is provided. The inspection method includes monitoring power of a reflected wave of a power wave supplied from a source power supply for generation of plasma in a plasma processing apparatus, and obtaining a fluctuation amount of a measured value within a period after initiation...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
09.09.2021
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| Subjects | |
| Online Access | Get full text |
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| Abstract | An inspection method is provided. The inspection method includes monitoring power of a reflected wave of a power wave supplied from a source power supply for generation of plasma in a plasma processing apparatus, and obtaining a fluctuation amount of a measured value within a period after initiation of the supply of the power wave. The fluctuation amount the measured value is a fluctuation amount indicating a fluctuation in a peak-to-peak voltage at a lower electrode of the substrate support in the chamber or a fluctuation amount indicating a fluctuation in impedance of a load including the lower electrode. |
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| AbstractList | An inspection method is provided. The inspection method includes monitoring power of a reflected wave of a power wave supplied from a source power supply for generation of plasma in a plasma processing apparatus, and obtaining a fluctuation amount of a measured value within a period after initiation of the supply of the power wave. The fluctuation amount the measured value is a fluctuation amount indicating a fluctuation in a peak-to-peak voltage at a lower electrode of the substrate support in the chamber or a fluctuation amount indicating a fluctuation in impedance of a load including the lower electrode. |
| Author | KUSANO, Shu HIRAYAMA, Yusuke |
| Author_xml | – fullname: KUSANO, Shu – fullname: HIRAYAMA, Yusuke |
| BookMark | eNrjYmDJy89L5WQw9PQLDnB1DvH091PwdQ3x8HdRcPRzUQjwcQz2dVQICPJ3dg0O9vRzV3AMCHAMcgwJDeZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRoZGFgYmBoaOhsbEqQIA_MopTg |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| ExternalDocumentID | US2021280401A1 |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_US2021280401A13 |
| IEDL.DBID | EVB |
| IngestDate | Fri Jul 19 13:56:16 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_US2021280401A13 |
| Notes | Application Number: US202117193205 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210909&DB=EPODOC&CC=US&NR=2021280401A1 |
| ParticipantIDs | epo_espacenet_US2021280401A1 |
| PublicationCentury | 2000 |
| PublicationDate | 20210909 |
| PublicationDateYYYYMMDD | 2021-09-09 |
| PublicationDate_xml | – month: 09 year: 2021 text: 20210909 day: 09 |
| PublicationDecade | 2020 |
| PublicationYear | 2021 |
| RelatedCompanies | TOKYO ELECTRON LIMITED |
| RelatedCompanies_xml | – name: TOKYO ELECTRON LIMITED |
| Score | 3.3508737 |
| Snippet | An inspection method is provided. The inspection method includes monitoring power of a reflected wave of a power wave supplied from a source power supply for... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY |
| Title | INSPECTION METHOD AND PLASMA PROCESSING APPARATUS |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210909&DB=EPODOC&locale=&CC=US&NR=2021280401A1 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFPVNp-LHlILSt-Kattv6UCRrO4fYNqyt7G00bQaCdMNV_Pe9hE33tLckB3dJ4O7yS-4uAI_9qiK9oqgMx3IrwzarhcEHTmE4wikEGfZKXsps5CjuT3L7debMWvC5zYVRdUJ_VHFE1KgS9b1R9nr1f4kVqNjK9RP_wKHl8zjzAn2DjokMM3T1YOSFLAkSX_d9L0_1eKpoKBrRBEWsdCAP0rLSfvg-knkpq12nMj6FQ4b86uYMWqLuwLG__XutA0fR5skbmxvtW5-DiUibhSrqQ4vCbJIEGo0Djb3RNKIamya-tI3xi0YZo1Oa5ekFPIzDzJ8YKHv-t9R5nu5O1LqEdr2sxRVohJicD9AyEUFsviiGhSlMF5VLEIdbgl9Ddx-nm_3kWziRXRU75Xah3Xx9izt0tg2_V3v0C4ltfgc |
| link.rule.ids | 230,309,786,891,25594,76906 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3fT8IwEL4QNOKbokYUdYlmb4usMGAPxJRtOJVtDdsMb2RlJTExg8iM_77XBpQn3ppecv2R3F2_9rsrwEM3z0kry3LDatu50THzhcF7VmZYwsoE6bfmfC6zkYOw66ed16k1rcDnNhdG1Qn9UcUR0aLmaO-l8ter_0ssV3Er14_8A7uWT6Nk4OobdEwkzdDW3eHAY5EbObrjDNJYDydKhkMjmqCIlQ56sj6vPDy9D2Veymo3qIxO4JChvqI8hYoo6lBztn-v1eEo2Dx5Y3NjfeszMBFpM0-xPrTAS_zI1WjoamxM44BqbBI50jeGzxpljE5oksbncD_yEsc3cOzZ31Jnabw70fYFVItlIS5BI8TkvIeeiQjS4Yusn5nCtNG4BLF4W_AGNPdputovvoOanwTj2fglfLuGYylSPCq7CdXy61vcYOAt-a3ar1-WSID0 |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=INSPECTION+METHOD+AND+PLASMA+PROCESSING+APPARATUS&rft.inventor=KUSANO%2C+Shu&rft.inventor=HIRAYAMA%2C+Yusuke&rft.date=2021-09-09&rft.externalDBID=A1&rft.externalDocID=US2021280401A1 |