SEMICONDUCTOR DEVICE

There is provided a semiconductor device having a configuration suitable for higher integration. The semiconductor device includes: a first substrate having a first front surface; and a second substrate having a second front surface joined to the first front surface. The first substrate includes a f...

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Bibliographic Details
Main Authors SHIMIZU, Kan, SUEMITSU, Katsumi
Format Patent
LanguageEnglish
Published 02.09.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:There is provided a semiconductor device having a configuration suitable for higher integration. The semiconductor device includes: a first substrate having a first front surface; and a second substrate having a second front surface joined to the first front surface. The first substrate includes a first wiring layer including a first wiring line, and a first semiconductor layer that are stacked in order from a position close to the second substrate, and the second substrate includes a storage element layer including a storage element, and a second semiconductor layer that are stacked in order from a position close to the first substrate.
Bibliography:Application Number: US201917259949