ELECTRON MIGRATION CONTROL IN INTERCONNECT STRUCTURES

• Main Authors: Hsu, Kai-Shiung, CHEN, Chun-Jen, Lin, Jyh-nan, Liu, Ding-I
• Format: Patent
• Language: English
• Published: 29.07.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method for improving reliability of interconnect structures for semiconductor devices is disclosed. The method includes forming a contact structure on a transistor and forming a metallization layer on the contact structure. The forming the metallization layer includes depositing an inter-metal die...