MICROFABRICATED AIR BRIDGES FOR QUANTUM CIRCUITS
A method for fabricating a bridge structure in a quantum mechanical device includes providing a substructure including a substrate having deposited thereon a layer of a first superconducting material divided into a first portion, a second portion and a third portion that are electrically insulated f...
Saved in:
Main Authors | , , , , |
---|---|
Format | Patent |
Language | English |
Published |
15.07.2021
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | A method for fabricating a bridge structure in a quantum mechanical device includes providing a substructure including a substrate having deposited thereon a layer of a first superconducting material divided into a first portion, a second portion and a third portion that are electrically insulated from each other; depositing a sacrificial layer on the substructure; electrically connecting the first portion and the second portion with a strip of a second superconducting material, the second superconducting material being different from the first superconducting material; and removing a portion of the sacrificial layer so as to form a bridge structure over the third portion between the first portion and the second portion, the bridge structure electrically connecting the first portion to the second portion while not electrically connecting the third portion to the first portion and not electrically connecting the third portion to the second portion. |
---|---|
AbstractList | A method for fabricating a bridge structure in a quantum mechanical device includes providing a substructure including a substrate having deposited thereon a layer of a first superconducting material divided into a first portion, a second portion and a third portion that are electrically insulated from each other; depositing a sacrificial layer on the substructure; electrically connecting the first portion and the second portion with a strip of a second superconducting material, the second superconducting material being different from the first superconducting material; and removing a portion of the sacrificial layer so as to form a bridge structure over the third portion between the first portion and the second portion, the bridge structure electrically connecting the first portion to the second portion while not electrically connecting the third portion to the first portion and not electrically connecting the third portion to the second portion. |
Author | Adiga, Vivekananda P Patel, Jyotica Yan, Hongwen Rath, David L PAPALIA, JOHN M |
Author_xml | – fullname: Adiga, Vivekananda P – fullname: Patel, Jyotica – fullname: Rath, David L – fullname: Yan, Hongwen – fullname: PAPALIA, JOHN M |
BookMark | eNrjYmDJy89L5WQw8PV0DvJ3c3QK8nR2DHF1UXD0DFIAclzcXYMV3PyDFAJDHf1CQn0VnD2DnEM9Q4J5GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakl8aLCRgZGhkaG5pYm5o6ExcaoAxSMpAg |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences Physics |
ExternalDocumentID | US2021217947A1 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US2021217947A13 |
IEDL.DBID | EVB |
IngestDate | Fri Aug 30 05:41:16 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US2021217947A13 |
Notes | Application Number: US202016741595 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210715&DB=EPODOC&CC=US&NR=2021217947A1 |
ParticipantIDs | epo_espacenet_US2021217947A1 |
PublicationCentury | 2000 |
PublicationDate | 20210715 |
PublicationDateYYYYMMDD | 2021-07-15 |
PublicationDate_xml | – month: 07 year: 2021 text: 20210715 day: 15 |
PublicationDecade | 2020 |
PublicationYear | 2021 |
RelatedCompanies | INTERNATIONAL BUSINESS MACHINES CORPORATION |
RelatedCompanies_xml | – name: INTERNATIONAL BUSINESS MACHINES CORPORATION |
Score | 3.3490229 |
Snippet | A method for fabricating a bridge structure in a quantum mechanical device includes providing a substructure including a substrate having deposited thereon a... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | CALCULATING COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS COMPUTING COUNTING ELECTRICITY PHYSICS |
Title | MICROFABRICATED AIR BRIDGES FOR QUANTUM CIRCUITS |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210715&DB=EPODOC&locale=&CC=US&NR=2021217947A1 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3da8IwED_Efb5tbmMfbhQ2-iYzNWnnQxk1bdGBVvoxfBPTDxBGlbVj__4umW4--ZbkIFyO3CW_y90F4ImZOROZIdD6ZVaHpkaBLRlgk4n0RRhFn-QywXk8MYcJfZuxWQM-trkwqk7otyqOiBqVor7Xyl6v_51YroqtrJ7FEodWr35su_oGHSN-sQjT3YHtTQM34DrndhLpk1DRDLn5LAex0oG8SMtK-977QOalrHcPFf8MDqc4X1mfQyMvW3DCt3-vteB4vHnybsGRitFMKxzc6GF1AV0UXhj4zkD-2Ii2R3NGofYbJxNpiOs0vKhO4mSs8VHIk1EcXcKj78V82EEm5n9rnifRLse9K2iWqzK_Bk2YPUQcRkbNlNC8i8CYkAXLGKVFf8GYeQPtfTPd7iffwansSuclYW1o1p9f-T2eurV4UML6AUSyf_Q |
link.rule.ids | 230,309,786,891,25594,76904 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_G_JhvOhU_phaUvg3XrmndQ5EtXVl1bUc_ZG9l6QcI0g1b8d_3Ejfd097CHYRLyN3ld7m7ADwQPScsUxlav8zoaqla4Ign2GQsfWJqMVByXuDsevok1l7mZN6Aj00tjOgT-i2aI6JGpajvtbDXq_8gliVyK6tH9o6k5bMdmZa8RseIXwyFyNbIHM98y6cypWYcyl4geCo_fMYQsdKegaCQd9ofv414Xcpq26nYx7A_w_nK-gQaedmGFt38vdaGQ3f95N2GA5GjmVZIXOthdQo93LzAt4cj_mMj2h5p6ATSb55MKCGuk_Ci6kWxK1EnoLEThWdwb48jOumiEMnfmpM43Ja4fw7NclnmFyAxvY-IQ800PVW0vIfAWFEWJCOaVgwWhOiX0Nk109Vu9h20JpE7TaaO93oNR5zFA5kK6UCz_vzKb9AD1-xWbNwPZoCC3w |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=MICROFABRICATED+AIR+BRIDGES+FOR+QUANTUM+CIRCUITS&rft.inventor=Adiga%2C+Vivekananda+P&rft.inventor=Patel%2C+Jyotica&rft.inventor=Rath%2C+David+L&rft.inventor=Yan%2C+Hongwen&rft.inventor=PAPALIA%2C+JOHN+M&rft.date=2021-07-15&rft.externalDBID=A1&rft.externalDocID=US2021217947A1 |