ELECTRONIC DEVICE PACKAGING WITH GALVANIC ISOLATION

• Main Authors: Bartolo, Marlon, Estacio, Maria Cristina, Quinones, Maria Clemens Ypil, Wu, Chung-Lin
• Format: Patent
• Language: English
• Published: 24.06.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

In a general aspect, an electronic device assembly can include a dielectric substrate having a first surface and a second surface opposite the first surface and a leadframe including: a first leadframe portion including a first plurality of signal leads; and a second leadframe portion including a se...