SENSOR SYSTEMS AND METHODS FOR PROVIDING SENSOR SYSTEMS
A sensor assembly includes a die substrate and a metalized layer formed on the die substrate. The metalized layer is formed of a first metal material and includes a bonding pad to facilitate electrically coupling the sensor assembly to a sensor system. A re-metalized bump is formed on the bonding pa...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
17.06.2021
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A sensor assembly includes a die substrate and a metalized layer formed on the die substrate. The metalized layer is formed of a first metal material and includes a bonding pad to facilitate electrically coupling the sensor assembly to a sensor system. A re-metalized bump is formed on the bonding pad of a second metal material and is electrically coupled to the metalized layer. An adhesive is applied to the re-metalized bump and facilitates mechanically coupling the sensor assembly to the sensor system. |
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| AbstractList | A sensor assembly includes a die substrate and a metalized layer formed on the die substrate. The metalized layer is formed of a first metal material and includes a bonding pad to facilitate electrically coupling the sensor assembly to a sensor system. A re-metalized bump is formed on the bonding pad of a second metal material and is electrically coupled to the metalized layer. An adhesive is applied to the re-metalized bump and facilitates mechanically coupling the sensor assembly to the sensor system. |
| Author | Stoffel, Nancy Cecelia Esler, David Richard |
| Author_xml | – fullname: Stoffel, Nancy Cecelia – fullname: Esler, David Richard |
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| Notes | Application Number: US201916713437 |
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| RelatedCompanies | General Electric Company |
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| Snippet | A sensor assembly includes a die substrate and a metalized layer formed on the die substrate. The metalized layer is formed of a first metal material and... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING |
| Title | SENSOR SYSTEMS AND METHODS FOR PROVIDING SENSOR SYSTEMS |
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