MOISTURE SEAL FOR PHOTONIC DEVICES

The present disclosure relates to semiconductor structures and, more particularly, to a moisture seal for photonic devices and methods of manufacture. The structure includes: a first trench in at least one substrate material; a guard ring structure with an opening and which at least partially surrou...

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Bibliographic Details
Main Authors NUMMY, Karen A, WU, Zhuojie, OAKLEY, Jennifer A, ALDERMAN, Jeremy S, HOUGHTON, Thomas F, SAHIN, Asli
Format Patent
LanguageEnglish
Published 17.06.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present disclosure relates to semiconductor structures and, more particularly, to a moisture seal for photonic devices and methods of manufacture. The structure includes: a first trench in at least one substrate material; a guard ring structure with an opening and which at least partially surrounds the first trench; and a second trench at a dicing edge of the substrate, the second trench being lined on sidewalls with barrier material and spacer material over the barrier material.
Bibliography:Application Number: US201916713709