LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY
Provided is a method for removing an electronic component from a printed wiring board. The method comprises applying an embrittlement agent to a lead of an electronic component that is soldered to the printed wiring board. The electronic component is removed from the printed wiring board by breaking...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English |
Published |
22.04.2021
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!